Shenzhen,China EMS PCB Assembly Service
Production capability:
To shorten the clients' product cycle time to market,IBE Group invested in modernized equipment,such as automatic multi-layered PCB production equipment,high speed chip mounters and
online SPI machines.
Our PCB production capacity is up to 180,000 square meters a month.
We have 14 SMT lines,20 DIP lines,9 Assembly lines,12 testing lines.
IBE can mount chip components including 0201 and 01005 as well as QFP,BGA and fine pitch parts down to 0.3mm precision.
We can do many kinds of test,like X-Ray,Rohs,temperature test,Push and Pull test.
IBE sticks to the rigorous quality management,procedure control and sets up 100% complete AOI inspection.
We also provide technical support for our customer on analysis of design for manufacturability,product fault judgment,PCB layout components selection and component replacement evaluation,etc.
IBE has own R&D center with 30 engineers,they are experienced in software programming,circuit design and mechanical structure design.
| 1 | Material | PR4,Halogen free, High TG,CEM3,PTFE,Aluminum BT,Rogers |
| 2 | Board Thickness | Mass Production:0.3-3.5mm Samples:0.21-6.0mm |
| 3 | Surface Finish | HASL,OSP,Immersion Silver/Gold/SN,Flash Gold, Gold Finger,Hard Gold Plating |
| 4 | PCB Panel Size | Max Mass Productoin: 610x460mm Sample:762x508mm |
| 5 | Layer | Mass production:2-58 Layers, Samples:1-64 Layers |
| 6 | Min. Drill Hole Size | Laser Drill 0.1mm,Machine Drill 0.2mm |
| 7 | PCBA QC | X-ray,AOI Test,Functional Test |
| 8 | Speciality | Automotive,Medical/Gaming/Smart Device,Computer,LED/Lighting,etc |
| 9 | Sanforized | Buried via, Blind via, Mixed Pressure,Embedded Resistance,Embedded Capacitance, Local Mixed Pressure, Local High Density, Back Drill, Impedance Control |
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